Senior Assembly and Packaging Engineer - Penang

TalentSource is an Executive Search company providing value-added talent solution to MNC and local clients. We build meaningful and rewarding relationships between top-tier executives and our valued clients, while actively catering to both parties’ need for confidentiality, dignity, integrity and professionalism.

Responsibilities

• Design, develop, evaluate, select and improve semiconductor packages for company products.

• Work with both local and offshore subcontractors to sustain current production, improve yields and drive/participate continuous improvement programs.

• Generate and implement assembly documentation for prototypes and productions.

• Provide technical support to IC designers, product engineers and business managers for product definition, cost analysis and engineering experiments.

• Oversee new package and process change qualification and production ramp-up.

• Oversee company package related database information.

Requirements

• Bachelor’s Degree in Mechanical or Electrical Engineering plus 5 – 10 years of experience in IC assembly and package engineering. Required experience includes experience, knowledge or ability in:

• Semiconductor IC environment

• Plastic IC packaging design, materials selection, thermal management, specification documentation, reliability theory

• Assembly manufacturing process engineering (Wafer thinning, Saw, D/A, Wire-bond, Mold, Marking, Plating, Trim/Form, Inspection, Process Controls, Soldering)

• Assembly design rule management, design of experiments, process control, failure analysis techniques and reliability testing

• Interface with subcontractors and packaging houses

• DOE, SPC, AutoCAD tools

• Excellent written and verbal communication skills (English). Good organizational, project management and problem solving abilities

• Advanced Excel Skills; fluent in all of the MS Office applications.

• Ability to work independently.