Staff Engineer-Manufacturing (Materials & Process)

TalentSource is an Executive Search company providing value-added talent solution to MNC and local clients. We build meaningful and rewarding relationships between top-tier executives and our valued clients, while actively catering to both parties’ need for confidentiality, dignity, integrity and professionalism.

Responsibilities

• 1. Preparation of roadmaps for complete new materials. Conception and verification in cooperation with suppliers.

• 2. Preparation of roadmaps for die attach / tapes / encapsulation material. Select and verify of respective materials for the platforms and the package/modules development projects.

• 3. Involvement in design new package, tape, packaging materials and process advancement (Au to Cu etc.) base on the capability of materials, processes and suppliers.

• 4. Evaluate and develop second or new sourcing and localization for all CC materials especially on the F1 materials

• 5. Bridge and alignment with sister site on all the new materials and new packages development related issues.

• 6. Productivity improvement inclusive but not limited to:

• - Identify improvement opportunity.

• - New process sharing/ benchmarking.

• - Process robustness .

• 7. Process Engineering Future Roadmap Knowledge capability (break-thru improvement) with new ideas.

• 8. Knowledge and skill transfer from across sister site.

Requirements

• 1. Master/ PHD in Material engineering.

• 2. Over 10 years working experience in Semicon Packing.

• 3. 8 years experience in FOL engineering, especially on Cu, Wire Bonding.

• 4. Strong materials analysis skill and theory background, e,g. SEM, EDX, SIMS, FTIR, Auger, etc.

• 5. Excellent communication and presentation skills.

• 6. Good oral and written English.