Staff Engineer-FOL Process

TalentSource is an Executive Search company providing value-added talent solution to MNC and local clients. We build meaningful and rewarding relationships between top-tier executives and our valued clients, while actively catering to both parties’ need for confidentiality, dignity, integrity and professionalism.

Responsibilities

• 1. Lead a group of FOL engineers work toward characterize die/wire bond process, material selection, qualification, and UPH improvement

• 2. Able to lead, grow and coach engineers on problem solving skill, communication, cost saving project implementation and breakthrough invention on die/wire bond process

• 3. Involve in receiving product/technology transfer from NPI to ensure a flawless startup

• 4. Improve and sustain process yield, drive process restoration, resolve daily bond-ability issues, process performance monitoring, production quality investigation, product failure analysis, and dealing process deviation

• 5. Benchmark of process technology and best practices

• 6. Take lead on cost saving projects to achieve lean six sigma and operation excellence.

Requirements

• Bachelor degree in Electrical, Mechanical, Electronic or Materials Engineering

• At least 8 years of relevant experience in semiconductor industry

• Lesser work experience for university graduates (master level) and PhD will be consider.

• In- depth understanding of principles and concepts in own technical / specialist area

• Strong in problem solving skills and analytical skills

• Proven leadership and communications skills.

• Knowledge of 6-sigma programs, 8D process, FMEA, SPC and other formal problem solving skills is preferred.